ALN Ceramics

With the rapid advancement of technology, the semiconductor industry has increasingly higher demands for material performance. Aluminum nitride ceramics, as a new type of high thermal conductivity ceramic material, have gained a significant position in the semiconductor industry due to their unique properties,such as aluminum nitride ceramic cover plate, aluminum nitride Insulators,semiconductor heat sinks and other high thermal conductivity ceramics.      

In recent years, nitride ceramics have become a hot topic in materials science. Aluminum nitride (AlN) exhibits excellent thermal conductivity, with a single crystal thermal conductivity reaching 320 W/(m·K), along with low dielectric constant, low dielectric loss, high elastic modulus, and bending strength. Boron nitride (BN) features a low dielectric constant, low dielectric loss, good thermal shock resistance, and excellent machinability. By utilizing the principle of composite material performance stacking, combining aluminum nitride and boron nitride can yield AlN-BN composite ceramics with superior mechanical, dielectric, and thermal properties.      

Aluminum Nitride heat sinks are ideal for heat dissipation in high-performance electronic devices due to their excellent thermal conductivity and insulating properties. Made of aluminum nitride (AlN), the heatsink can effectively conduct heat to ensure the stable operation of electronic components. Its high thermal conductivity of 170 -210W/m-K significantly improves heat dissipation efficiency, while its excellent electrical insulation performance supports high voltage applications. Whether used in new energy vehicles, power electronics or high-power LED lighting, Aluminum Nitride heat sinks provide excellent thermal management solutions to ensure the reliability and durability of devices in high-temperature environments.        

Aluminum nitride heat sinks are high thermal conductivity materials with high strength, high hardness, excellent wear resistance, and good corrosion resistance. Its thermal conductivity is extremely high, approximately five times that of aluminum and three times that of copper, making it one of the highest thermal conductive materials currently available. Additionally, aluminum nitride heat sinks possess very high strength, allowing them to withstand significant pressure and tensile forces without deforming or damaging easily. They also exhibit good corrosion and wear resistance, enabling them to operate stably in harsh environments for extended periods. Aluminum nitride heat sinks are widely used in various fields such as electronics, LED lighting, automotive electronics, and aerospace for heat dissipation and thermal management, particularly in high-power electronic devices. Due to their unique physical and chemical properties, they can quickly dissipate generated heat, maintaining a stable operating temperature for equipment while also extending its lifespan.      

Aluminum nitride has a thermal conductivity of 170-230 W/m-K, making it the ceramic material with the most superior thermal conductivity. In comparison, conventional semiconductor materials such as silicon have a thermal conductivity of about 150 W/m-K, while alumina (Al₂O₃) has a thermal conductivity of only about 30 W/m-K. This high thermal conductivity has led aluminum nitride radiator to the widespread use in products that require effective heat dissipation, such as electronic devices and high-power LEDs.      

Aluminum Nitride (AlN) ceramic heat sinks are high-performance thermal management components designed for high-power electronic devices. Made from aluminum nitride material, these heat sinks feature excellent thermal conductivity and electrical insulation properties, efficiently transferring heat away from sensitive electronic components to maintain device stability and extend its lifespan. AlN ceramic heat sinks are not only resistant to high temperatures and corrosion but also offer superior mechanical strength and chemical stability, making them ideal for applications such as LED lighting, power semiconductors, and high-frequency communications. Their outstanding thermal performance ensures reliable operation of devices under heavy loads, meeting the stringent thermal management requirements of modern electronic systems.      

Aluminum nitride thermal conductivity sheet produced by Xiamen Juci Company has a high thermal conductivity of 170-210W/m.k, the surface is flat and smooth, with the use of silicone grease can effectively reduce the thermal resistance of the contact, high strength is not easy to break, high temperature and high pressure resistance, high dielectric strength, resistance to corrosion of acids and alkalis, durable.      

Aluminum nitride thermal sheet has excellent thermal conductivity. Compared to traditional heat dissipation materials, aluminum nitride thermal sheet have higher thermal conductivity, allowing heat to be transferred to the heat sink surface more rapidly, thus improving heat dissipation efficiency. This is crucial for the stable operation of electronic devices, especially in high-temperature environments, as it effectively reduces the operating temperature of electronic components and extends their lifespan. Additionally, aluminum nitride thermal sheet possess outstanding insulation properties. If the heat generated by electronic devices is not dissipated promptly, it can lead to overheating and even damage. As an insulating material, aluminum nitride thermal sheet can effectively isolate heat, protecting electronic components from thermal effects and ensuring normal device operation. During application, aluminum nitride thermal sheet also demonstrate high stability and reliability, functioning stably in high-temperature environments for extended periods without deformation or oxidation, thereby ensuring long-lasting and consistent heat dissipation performance.        

Etching nozzles are components used in semiconductor manufacturing to remove unwanted materials from the surface of wafers. Aluminum nitride ceramic etching nozzles are highly wear-resistant, corrosion-resistant, and highly accurate, and are capable of working stably for long periods of time in high-temperature, high-pressure, and high-corrosive environments, improving etching results and nozzle service life.   Unlike other manufacturers' machining methods, we make aluminum nitride etching nozzles by injection molding process, which has the following advantages： 1.Can make complex shapes2.High production quantities3.Excellent performance4.Low cost

The application of aluminum nitride in e-cigarettes is mainly reflected in the preparation of its high heat generation efficiency e-cigarette atomizing core.  Aluminum nitride (AlN), as a material with excellent thermal conductivity, has applications not only limited to heat dissipation substrates and electronic device packages, but also includes heat exchangers and functional materials and other fields. In the field of electronic cigarettes, the application of aluminum nitride is mainly embodied in the preparation of its high thermal efficiency electronic cigarette atomized core. The heat generating structure of such an atomized core employs a NiCuSiAl heat generating coating, and by controlling the components in the layer at an appropriate ratio, a coating with a low resistivity and a high electro-thermal conversion coefficient is formed. This coating enables the prepared atomizer core to be rapidly heated from room temperature to 600°C at a small rated power of 12W or less to achieve a large and full smoke volume. In addition, by providing a transition layer and a protective layer, this type of atomizer core not only has a good heating effect, but also better prevents oxidation and easy peeling of the heating coating, which extends the service life of the atomizer core1. This application demonstrates the potential of aluminum nitride in improving the thermal efficiency of e-cigarette atomizer cartridges, which enhances the user experience by optimizing the thermal conductivity and thermal stability of the material, and also provides a new material solution for the development of e-cigarette technology.      

Aluminum nitride is a material with excellent physical properties with the following characteristics: 1. stable crystal structure, small coefficient of thermal expansion and high thermal conductivity, can be made into high thermal conductivity substrate. 2. excellent electrical properties such as wide bandgap, high heat capacity and high dielectric constant; 3. good photoelectric properties and processability.      

Aluminum nitride ceramics can be used as vacuum evaporation and metal smelting containers, especially suitable for aluminum vacuum evaporation crucible, because aluminum nitride ceramics are heated in a vacuum with low vapor pressure, and will not contaminate aluminum even if decomposed. In the semiconductor industry, using aluminum nitride crucible instead of quartz crucible to synthesize arsenide can completely eliminate the contamination of Si on GaAs and obtain high purity products,and it also can be used as Electronic Material Crucible,Industrial Melting Crucibles,Chemical Analysis Crucibles,and so on. Aluminum nitride crucibles are a new type of high-temperature crucible, offering greater heat resistance and chemical corrosion resistance compared to quartz crucibles. The advantages of aluminum nitride crucibles over quartz crucibles include: Higher Heat Resistance: Aluminum nitride crucibles can operate at temperatures up to 1800°C, exceeding quartz crucibles by more than 300°C, thus meeting more high-temperature experimental requirements. Better Chemical Corrosion Resistance: Aluminum nitride crucibles demonstrate superior stability in corrosive media such as acids and bases, preventing corrosion and dissolution, making them suitable for use in harsher environments. Higher Wear Resistance: The hardness of aluminum nitride crucibles is over twice that of quartz crucibles, making them less prone to wear and extending their service life.