ALN Filler

Aluminum Nitride thermal filler can be added to resins or plastics to improve their thermal conductivity. It can also be used as a filler in thermal conductive adhesives, thermal grease, and other materials, enhancing the thermal conductivity of composite materials when incorporated into polymer matrices. These composite materials are widely used in electronic products, LED lighting, power supplies, and other fields.

Aluminum nitride thermal conductive powder has an extremely high thermal conductivity and can effectively transfer heat. By adding aluminum nitride filler to composite materials, the thermal conductivity of the composite can be significantly improved, thereby enhancing its heat dissipation capability. For example, in electronic packaging materials, aluminum nitride thermal conductive powder can increase the thermal conductivity of the packaging, effectively dissipating heat and preventing electronic devices from experiencing performance degradation due to temperature rise, ensuring the reliability and stability of electronic products.

Xiamen Juci Technology manufactures aluminum nitride filler of various particle sizes, with the smallest particle size being 1 micron. The 1um single crystal AlN filler has fine primary crystals, high sphericity, fast flow rate, and low thermal resistance, making them ideal for blending with larger particles to improve the thermal conductivity of thermal interface materials.

The 5µm Aluminum Nitride (AlN) Single Crystal Filler is a high-quality, advanced material specifically engineered for applications requiring superior thermal conductivity, electrical insulation, and mechanical strength. With a particle size of just 5µm, this powder offers excellent dispersion and is ideal for use in composite materials, enhancing the thermal management properties of electronic devices and semiconductor packaging. The single crystal structure of the AlN powder ensures high purity, reliability, and exceptional performance in demanding environments. It is widely used in industries such as electronics, LED technology, and heat dissipation solutions.

As a thermal conductive filler，Aluminum nitride filler has high thermal conductivity and electrical insulation , add AlN ceramic microsphere into the resin or plastic can significantly improve the thermal conductivity. The characteristics of AlN ceramic microsphere：1. Spherical/Near-spherical2. High filling volume3. High liquidity4. Narrow particle size distribution5. High thermal conductivity6. High insulation