ALN Filler

Xiamen Juci Technology Co., Ltd. introduces high thermal conductivity aluminum nitride (AlN) gap filler powder (120μm), a high thermal conductivity interface material designed for advanced thermal applications. With exceptional thermal conductivity (theoretical value: 170-200 W/m·K), low dielectric constant, and outstanding insulation properties, this product is an ideal choice for electronic packaging, composite materials, thermal interface materials, and more. The precisely controlled 120μm particle size ensures excellent dispersibility and packing density, significantly enhancing the thermal management efficiency of matrix materials. Key Features: 1、Ultra-High Thermal Conductivity: Dramatically improves the thermal performance of ceramic and polymer composites, ensuring stable operation of electronic devices by efficiently dissipating heat. Forms an effective thermal network for rapid heat transfer, reducing operating temperatures. 2、 Low Oxygen Content & High Crystallinity: Low oxygen content enhances intrinsic thermal conductivity, while high crystallinity ensures stable and reliable performance even in harsh environments. 3、Narrow Particle Size Distribution & Excellent Flowability: Precisely controlled 120μm particle size with uniform isometric morphology ensures easy dispersion during production and consistent end-product performance, minimizing defect rates. 4、 Superior Hydrolysis Resistance: Surface-modified for excellent moisture resistance, ensuring long-term storage stability without performance degradation.

Xiamen Juci Technology Co., Ltd. introduces its high thermal conductivity series 100μm polycrystalline aluminum nitride (AlN) filler powder, a high-purity ceramic filler designed for advanced thermal management composites. Utilizing cutting-edge synthesis and classification technology, this product delivers exceptional thermal conductivity, excellent chemical stability, and optimized particle size distribution. It significantly enhances the heat dissipation performance of polymers, adhesives, and ceramic matrices, making it ideal for applications in electronic packaging, LED cooling, 5G communication devices, and high-power modules. Key Features: 1、Ultra-High Thermal Conductivity Polycrystalline AlN boasts a theoretical thermal conductivity of 170-200 W/(m·K), effectively addressing high heat flux dissipation challenges in electronic components. Low coefficient of thermal expansion (≈4.6×10⁻⁶/K), matching semiconductor materials to minimize interfacial stress. 2、Precise Particle Size Control D50 ≈ 100μm, with uniform particle distribution, optimizing packing density to form efficient thermal pathways. Customizable surface treatments (e.g., silane coupling agent modification) to improve compatibility with resins and metals. 3、High Purity & Reliability Purity ≥ 99%, oxygen content < 1%, ensuring minimal impact on dielectric properties. High-temperature resistance (>1800°C) and corrosion resistance, suitable for harsh environments. 4、Versatile Applications Thermal Adhesives/Pastes: Increases thermal conductivity when filled. Ceramic Matrix Composites: Used for high-thermal-conductivity insulating substrates or packaging materials. Thermal Interface Materials (TIMs): Reduces contact thermal resistance in electronic assemblies.

The 80μm Aluminum Nitride (AlN) Filler, developed by Xiamen Juci Technology, is a high-performance ceramic material designed for electronic packaging, thermal interface materials (TIMs), and high-thermal-conductivity composites. Featuring a precisely controlled particle size distribution (D50≈80μm), ultra-high purity (≥99%), and exceptional thermal conductivity (170-200 W/(m·K)), it significantly enhances the thermal management efficiency of polymer, metal, or ceramic matrices. It is ideal for demanding heat dissipation applications in 5G communications, new energy vehicles, power electronics, and more. Key Features: 1、Exceptional Thermal Conductivity Theoretical thermal conductivity of 170–200 W/(m·K), effectively addressing thermal management challenges in electronic devices.  2、Precise Particle Size Control Uniform distribution with an average particle size (D50) of 80μm ensures excellent dispersibility and compatibility with resin, metal, or ceramic matrices.  3、High Purity, Low Oxygen Content Purity ≥ 99%, oxygen content ≤ 1%, guaranteeing chemical stability and electrical insulation for high-frequency, high-voltage applications.  4、Low Dielectric Constant & Loss Low dielectric constant (ε ≈ 8.8) and minimal dielectric loss (tanδ < 0.001), ideal for high-frequency circuit packaging.  5、Outstanding Mechanical Properties High hardness and wear resistance enhance the mechanical strength of composites.

The S-Series 80μm AlN thermal conductive filler is a high-performance thermal management material designed for high-power electronics, 5G communications, new energy vehicles, LED lighting, and advanced chip cooling applications. Utilizing proprietary particle gradation technology and surface modification processes, this product achieves an ultra-high thermal conductivity, significantly improving heat dissipation efficiency and ensuring stable, long-lasting performance for modern electronic devices. Key Features: 1、Exceptional Thermal Conductivity Made from high-purity ceramic materials (such as aluminum nitride) and optimized 80μm particle distribution, it forms a dense thermal conduction network, increasing thermal conductivity compared to conventional fillers and effectively reducing interfacial thermal resistance. 2、Precise Particle Size Control The fine 80μm particles provide excellent filling capability, ensuring tight contact with matrix materials (e.g., silicone, epoxy resin) and minimizing voids for rapid, uniform heat transfer. 3、Superior Electrical Insulation Maintains high insulation properties (volume resistivity >10¹⁴ Ω·cm) while enhancing thermal performance, making it ideal for sensitive electronic components. 4、Strong Chemical Stability Resistant to high temperatures and corrosion,  suitable for harsh operating environments. 5、Excellent Compatibility Can be easily incorporated into thermal greases, thermal pads, adhesives, and other composite materials to meet diverse application requirements.

Xiamen Juci Technology Co., Ltd. presents its 150μm high-purity aluminum nitride (AlN) filler powder, a functional ceramic filler designed for high-performance thermally conductive composite materials. With key advantages including ultra-fine particle size (150 microns), high purity (≥99%), and low oxygen content, this product significantly enhances the thermal conductivity of polymer, metal, or ceramic matrix composites. It is widely used in electronic packaging, thermal interface materials (TIMs), high-power LED heat dissipation, and more. Key Features: 1、Exceptional Thermal Conductivity AlN boasts a theoretical thermal conductivity of 170-200 W/(m·K), over five times higher than conventional alumina fillers, dramatically improving the overall thermal efficiency of composite materials. 2、Precise Particle Size Distribution D50: 150μm, uniform particle size, smooth surface, and excellent dispersibility ensure efficient thermal conductive network formation in the matrix. 3、High Purity & Low Oxygen Content Purity ≥99%, oxygen content ≤1%, minimizing impurities' impact on dielectric properties and thermal conductivity, making it ideal for high-frequency electronic devices. 4、Superior Electrical Insulation Volume resistivity >10¹⁴ Ω·cm, low dielectric constant (~8.8), suitable for high-insulation-demanding electronic packaging. 5、Strong Chemical Stability High-temperature resistance (stable in air up to 1400°C), corrosion resistance, and excellent compatibility with epoxy resins, silicone gels, and other matrix materials.

Xiamen Juceri Technology's 120μm Aluminum Nitride (AlN) filler powder is a high-purity, high-thermal-conductivity ceramic powder material, specifically designed for high-performance thermally conductive composites, electronic packaging, thermal interface materials (TIM), and high-thermal-conductivity plastics/rubbers. With its uniform particle size distribution (D50≈120μm) and excellent chemical stability, it significantly enhances the thermal conductivity of matrix materials while maintaining superior electrical insulation and mechanical strength. Key Features: 1、Ultra-High Thermal Conductivity Theoretical thermal conductivity of 170-200 W/(m·K), effectively improving the heat dissipation efficiency of composite materials. 2、Precise Particle Size Control Median particle size (D50) of 120μm with uniform distribution, ensuring easy dispersion and strong compatibility with resin/polymer matrices. 3、High Purity & Low Oxygen Content Purity ≥99%, oxygen content ≤1%, minimizing the impact of impurities on dielectric properties and thermal conductivity. 4、Excellent Insulation Performance Volume resistivity >10¹⁴ Ω·cm, suitable for electronic applications requiring high insulation. 5、Chemical Stability Resistant to high temperatures and corrosion, maintaining stable performance in high-temperature or humid environments. 6、Surface Modifiability Can be treated with silane coupling agents or other surface modifications upon request to enhance interfacial bonding with the matrix.

50μm aluminum nitride (AlN) ceramic microspheres are a high-performance thermal filler designed to enhance the thermal management properties of composite materials. With excellent thermal conductivity (~170-200 W/mK) and superior electrical insulation, AlN microspheres are an ideal choice for electronic packaging, thermally conductive adhesives, thermally conductive plastics, and high-power LED heat dissipation. Key Features: 1、High Thermal Conductivity: Effectively improves heat transfer efficiency in composites, ideal for critical cooling applications. 2、Uniform Particle Size: 50μm microspheres ensure even dispersion, optimizing mechanical and thermal performance. 3、Electrical Insulation: High resistivity makes it suitable for insulation requirements in electronics. 4、High-Temperature & Oxidation Resistance: Exceptional stability for high-temperature environments. 5、Lightweight: Low density reduces overall product weight.

30μm Aluminum Nitride (AlN) Ceramic Microspheres are high-performance inorganic non-metallic materials exhibiting outstanding thermal conductivity, electrical insulation, high-temperature resistance, and chemical stability. Their micron-scale spherical structure enables broad application prospects in advanced electronic packaging, composite reinforcement, thermal interface materials, and other fields. Key Features of 30μm Aluminum Nitride (AlN) Ceramic Microspheres: High Thermal Conductivity – With 170-200 W/(m·K) thermal conductivity, AlN microspheres significantly enhance heat dissipation in thermal interface materials (TIMs) and electronic packaging. Excellent Electrical Insulation – Ultra-high resistivity (>10¹⁴ Ω·cm) makes these AlN fillers ideal for high-voltage applications, PCB substrates, and insulating coatings. High-Temperature Resistance – Melting point of 2200°C ensures stability in extreme environments, suitable for aerospace, power electronics, and LED heat sinks. Low CTE (4.5×10⁻⁶/°C) – Matches semiconductor materials (Si, GaN, SiC), reducing thermal stress in chip packaging and power modules. High Purity & Chemical Stability – Corrosion-resistant and acid/alkali-proof, perfect for harsh industrial applications and chemical environments. Uniform Spherical Structure – Narrow particle distribution (D50≈30μm) ensures superior flowability and even dispersion in polymers, composites, and 3D printing materials.

Aluminum Nitride (AlN) thermal filler is a high-performance ceramic material widely used in thermal management applications due to its exceptional properties. Here’s a detailed breakdown of its functional roles: 1. Heat Dissipation (Primary Function) High Thermal Conductivity (~170-200 W/mK) – Efficiently transfers heat away from hotspots in electronic components (e.g., CPUs, power modules, LEDs), making AlN powder ideal for high thermal conductivity fillers. Reduces Thermal Resistance – Improves heat flow in composites (e.g., thermal interface materials (TIMs), epoxy resins), enhancing performance in electronic cooling solutions. 2. Electrical Insulation Dielectric Strength (>15 kV/mm) – Prevents electrical short circuits while conducting heat, critical for high-voltage applications (e.g., power electronics, EV batteries), where AlN ceramic filler ensures reliability. 3. Thermal Expansion Matching CTE (Coefficient of Thermal Expansion) ~4.5 ppm/K – Closely matches silicon and semiconductors, minimizing stress in bonded interfaces (e.g., chip packaging), making AlN single crystal filler a preferred choice for semiconductor thermal management. By incorporating ultra-pure AlN filler or nanoscale AlN powder, manufacturers can optimize thermal conductivity while maintaining electrical insulation, making it a top choice for advanced thermal management  ceramic materials.

Aluminum Nitride thermal filler can be added to resins or plastics to improve their thermal conductivity. It can also be used as a filler in thermal conductive adhesives, thermal grease, and other materials, enhancing the thermal conductivity of composite materials when incorporated into polymer matrices. These composite materials are widely used in electronic products, LED lighting, power supplies, and other fields.

Aluminum nitride thermal conductive powder has an extremely high thermal conductivity and can effectively transfer heat. By adding aluminum nitride filler to composite materials, the thermal conductivity of the composite can be significantly improved, thereby enhancing its heat dissipation capability. For example, in electronic packaging materials, aluminum nitride thermal conductive powder can increase the thermal conductivity of the packaging, effectively dissipating heat and preventing electronic devices from experiencing performance degradation due to temperature rise, ensuring the reliability and stability of electronic products.

Xiamen Juci Technology manufactures aluminum nitride filler of various particle sizes, with the smallest particle size being 1 micron. The 1um single crystal AlN filler has fine primary crystals, high sphericity, fast flow rate, and low thermal resistance, making them ideal for blending with larger particles to improve the thermal conductivity of thermal interface materials.