aluminum nitride (ALN) thermal sheet φ35*1mm

Aluminum nitride ceramics, as a high-performance ceramic material with excellent thermal conductivity, electrical insulation and mechanical strength, are widely used in electronics, aerospace, chemical and other fields. In the preparation process of aluminum nitride ceramics, forming technology is one of the key links, which affects the performance and quality of ceramic materials. At present, tape casting, injection molding and compression molding are commonly used molding methods in the preparation of aluminum nitride ceramics.   Ceramic injection molding (CIM) is an emerging technology for manufacturing complex shaped ceramic parts. It uses polymer materials as a carrier, mixes ceramic powder with polymer materials, and then prepares ceramic blanks with complex shapes by injection molding. In the preparation of aluminum nitride ceramics, ceramic injection molding technology has unique advantages. First, it can prepare aluminum nitride ceramic parts with complex shapes and fine structures to meet the needs of special applications. Secondly, the injection molding process can realize continuous and automated production, improving production efficiency and product quality.   The characteristic of Powder injection molding ALN ceramic1.Can make complex shapes2.High production quantities3.Excellent performance4.Low cost

Aluminum nitride ceramics, as a high-performance ceramic material with high thermal conductivity, electrical insulation and mechanical strength, are widely used in electronics, aerospace, chemical and other fields. In the preparation process of aluminum nitride ceramics, forming technology is one of the key links, which affects the performance and quality of ceramic materials. At present, tape casting, injection molding and compression molding are commonly used molding methods in the preparation of aluminum nitride ceramics. Press molding technology is a more traditional molding method, which is mainly applicable to the preparation of aluminum nitride ceramic products with simple shapes and low dimensional accuracy requirements. The technology is based on mixing aluminum nitride powder with the appropriate amount of organic additives and placing it into a mold, using external pressure to make the powder particles rearranged and tightly combined to form a dense billet.      

With the rapid development of microelectronics technology, the requirements of the device toward the direction of large capacity, high density, high speed, high power output, more and more complex devices on the substrate and packaging materials for heat dissipation put forward more and more high requirements. Traditional resin substrates and alumina ceramic substrates, the highest thermal conductivity are only 30w/(m-k) or so, far from meeting today's device heat dissipation requirements. In addition, ordinary aluminum nitride (aln) ceramic bending strength is generally less than 400mpa, limiting the industrial application of aluminum nitride (aln) ceramics. In contrast, hot-pressed aluminum nitride (aln) ceramics have both high thermal conductivity and high flexural strength properties, which have important application prospects.      

Aluminum nitride ceramics are high thermal conductivity ceramics,which have a coefficient of thermal expansion close to that of silicon, good insulation properties, moderate dielectric constant and dielectric loss, room temperature and high temperature mechanical properties and non-toxic and other excellent characteristics, as integrated circuits and high-power devices, substrate materials and electronic packaging materials have a broad application prospects.      

Aluminum nitride heat sink produced by Xiamen Juci Company has a high thermal conductivity of 170-210W/m.k, the surface is flat and smooth, with the use of silicone grease can effectively reduce the thermal resistance of the contact, high strength is not easy to break, high temperature and high pressure resistance, high dielectric strength, resistance to corrosion of acids and alkalis, durable.      

Aluminum nitride thermal conductivity ceramics have a high thermal conductivity of 180 W/m·K, making them one of the highest thermal conductivity materials among non-metallic substances (7-10 times that of aluminum oxide ceramics). They feature excellent mechanical properties, good machinability, high dimensional accuracy, a smooth surface, and no micro-cracks or warping. Their low dielectric constant and low dielectric loss ensure optimal electrical insulation performance. The material is environmentally friendly and non-toxic, can withstand temperatures up to 1800°C, is resistant to oil and chemical corrosion, and has a thermal expansion coefficient similar to silicon, with no hygroscopicity. It maintains stable performance and high reliability under high temperature and humidity conditions. With the widespread development of microelectronics, high thermal conductivity aluminum nitride ceramics are increasingly valued and used as substrate or packaging materials,such as aluminum nitride sheet,aln ceramic substrate,aluminum nitride thermal pad.      

Aluminum nitride ceramics, as a new type of inorganic non-metallic material, feature high strength, hardness, wear resistance, good thermal stability, and excellent thermal conductivity. They are suitable for extreme environments such as high temperatures, high pressures, and corrosive conditions. Their applications are broad, spanning fields such as electronics, aerospace, energy, and biomedical sciences.      

Aluminum nitride ceramic, as a new type of inorganic non-metallic material, possesses many unique properties, such as high strength, high hardness, high wear resistance, excellent thermal stability, and outstanding thermal conductivity. These characteristics make aluminum nitride ceramics have a broad range of applications in extreme environments, such as high temperatures, high pressures, and corrosive conditions.