Aluminum Nitride (AlN) thermal conducting filler CAS 24304-00-5

As a thermal conductive filler，Aluminum nitride filler has high thermal conductivity and electrical insulation , add AlN ceramic microsphere into the resin or plastic can significantly improve the thermal conductivity. The characteristics of AlN ceramic microsphere：1. Spherical/Near-spherical2. High filling volume3. High liquidity4. Narrow particle size distribution5. High thermal conductivity6. High insulation

The 5µm Aluminum Nitride (AlN) Single Crystal Filler is a high-quality, advanced material specifically engineered for applications requiring superior thermal conductivity, electrical insulation, and mechanical strength. With a particle size of just 5µm, this powder offers excellent dispersion and is ideal for use in composite materials, enhancing the thermal management properties of electronic devices and semiconductor packaging. The single crystal structure of the AlN powder ensures high purity, reliability, and exceptional performance in demanding environments. It is widely used in industries such as electronics, LED technology, and heat dissipation solutions.

Xiamen Juci Technology manufactures aluminum nitride filler of various particle sizes, with the smallest particle size being 1 micron. The 1um single crystal AlN filler has fine primary crystals, high sphericity, fast flow rate, and low thermal resistance, making them ideal for blending with larger particles to improve the thermal conductivity of thermal interface materials.

Aluminum nitride thermal conductive powder has an extremely high thermal conductivity and can effectively transfer heat. By adding aluminum nitride filler to composite materials, the thermal conductivity of the composite can be significantly improved, thereby enhancing its heat dissipation capability. For example, in electronic packaging materials, aluminum nitride thermal conductive powder can increase the thermal conductivity of the packaging, effectively dissipating heat and preventing electronic devices from experiencing performance degradation due to temperature rise, ensuring the reliability and stability of electronic products.

Aluminum Nitride thermal filler can be added to resins or plastics to improve their thermal conductivity. It can also be used as a filler in thermal conductive adhesives, thermal grease, and other materials, enhancing the thermal conductivity of composite materials when incorporated into polymer matrices. These composite materials are widely used in electronic products, LED lighting, power supplies, and other fields.

Aluminum Nitride (AlN) thermal filler is a high-performance ceramic material widely used in thermal management applications due to its exceptional properties. Here’s a detailed breakdown of its functional roles: 1. Heat Dissipation (Primary Function) High Thermal Conductivity (~170-200 W/mK) – Efficiently transfers heat away from hotspots in electronic components (e.g., CPUs, power modules, LEDs), making AlN powder ideal for high thermal conductivity fillers. Reduces Thermal Resistance – Improves heat flow in composites (e.g., thermal interface materials (TIMs), epoxy resins), enhancing performance in electronic cooling solutions. 2. Electrical Insulation Dielectric Strength (>15 kV/mm) – Prevents electrical short circuits while conducting heat, critical for high-voltage applications (e.g., power electronics, EV batteries), where AlN ceramic filler ensures reliability. 3. Thermal Expansion Matching CTE (Coefficient of Thermal Expansion) ~4.5 ppm/K – Closely matches silicon and semiconductors, minimizing stress in bonded interfaces (e.g., chip packaging), making AlN single crystal filler a preferred choice for semiconductor thermal management. By incorporating ultra-pure AlN filler or nanoscale AlN powder, manufacturers can optimize thermal conductivity while maintaining electrical insulation, making it a top choice for advanced thermal management  ceramic materials.

30μm Aluminum Nitride (AlN) Ceramic Microspheres are high-performance inorganic non-metallic materials exhibiting outstanding thermal conductivity, electrical insulation, high-temperature resistance, and chemical stability. Their micron-scale spherical structure enables broad application prospects in advanced electronic packaging, composite reinforcement, thermal interface materials, and other fields. Key Features of 30μm Aluminum Nitride (AlN) Ceramic Microspheres: High Thermal Conductivity – With 170-200 W/(m·K) thermal conductivity, AlN microspheres significantly enhance heat dissipation in thermal interface materials (TIMs) and electronic packaging. Excellent Electrical Insulation – Ultra-high resistivity (>10¹⁴ Ω·cm) makes these AlN ceramic fillers ideal for high-voltage applications, PCB substrates, and insulating coatings. High-Temperature Resistance – Melting point of 2200°C ensures stability in extreme environments, suitable for aerospace, power electronics, and LED heat sinks. Low CTE (4.5×10⁻⁶/°C) – Matches semiconductor materials (Si, GaN, SiC), reducing thermal stress in chip packaging and power modules. High Purity & Chemical Stability – Corrosion-resistant and acid/alkali-proof, perfect for harsh industrial applications and chemical environments. Uniform Spherical Structure – Narrow particle distribution (D50≈30μm) ensures superior flowability and even dispersion in polymers, composites, and 3D printing materials.